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Intel and Arm have announced "a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process." The companies will optimize Arm's chips and Intel's upcoming 18A node, which is supposed to be its most advanced node together with 20A.
"Intel 18A delivers two breakthrough technologies, PowerVia for optimal power delivery and RibbonFET gate all around (GAA) transistor architecture for optimal performance and power."
The collaboration will focus on mobile SoC designs first but might later expand into automotive, Internet of Things (IoT), data center, aerospace, and government applications.
"Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS’s robust manufacturing footprint that includes U.S.- and EU-based capacity."
As Intel is investing in manufacturing capacity around the world, this collaboration should enable a more balanced global supply chain for foundry customers working in mobile SoC design on Arm-based CPU cores. At the same time, Arm partners will be able to take full advantage of Intel’s open system foundry model, "which goes beyond traditional wafer fabrication to include packaging, software and chiplets."
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